Memorie RAM notebook Kingston, SODIMM, DDR4, 64GB, 3200MHz, CL20, 1.2V, Kit of 2
Memorie RAM notebook Kingston, SODIMM, DDR4, 64GB, 3200MHz, CL20, 1.2V,
465,50 lei
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Specificatii
Overview
| _Capacitate memorie RAM |
32GB |
|---|---|
| DRAM-Kit |
Yes |
| ECC |
No |
| Kit |
Yes |
| _Frecvența memorie RAM |
3200MHz |
| _Tip memorie RAM |
DDR4 |
| Cooling type |
Heatsink |
| Component for |
Laptop |
| Operating temperature (T-T) |
0 – 85 °C |
| Products per master (outer) case |
25 pc(s) |
| JEDEC standard |
Yes |
| Country of origin |
China, Taiwan |
| Internal memory |
64 GB |
| Harmonized System (HS) code |
84733020 |
| Height |
30 mm |
| __Latenta |
20 CL |
| Buffered memory type |
Unregistered (unbuffered) |
| Internal memory type |
DDR4 |
| Memory data transfer rate |
3200 MT/s |
| Row cycle time |
45.75 ns |
| Refresh row cycle time |
350 ns |
| Intel Extreme Memory Profile (XMP) |
2.0 |
| Programming power voltage (VPP) |
2.5 V |
| Package depth |
14 mm |
| Backlight |
No |
| Storage temperature (T-T) |
-55 – 100 °C |
| Package height |
171.5 mm |
| Memory voltage |
1.2 V |
| Memory layout (modules x size) |
2 x 32 GB |
| Package width |
95.3 mm |
| Master (outer) case width |
203.2 mm |
| Master (outer) case length |
311.2 mm |
| Master (outer) case height |
101.6 mm |
| Memory clock speed |
1600 MHz |
| Memory ranking |
2 |
| Depth |
69.6 mm |
| Memory form factor |
260-pin SO-DIMM |
| Module configuration |
4096M x 64 |
| CAS latency |
20 |
| Width |
3.8 mm |
| Kit quad channel |
Nu |
| Tip |
DDR4 SODIMM |
| Latenta |
17 – 20 CL |
| Tensiune alimentare |
1.2 V |
| Frecventa |
3200 MHz |
| Row active time |
26.25 ns |
| Capacitate |
64 GB |
| Kit dual channel |
Da |
| Weight |
15.2 g |
| Package weight |
40.3 g |
| Master (outer) case gross weight |
1.22 kg |
| Producator |
KINGSTON |
| Garantie |
999 |
Processor
| _Capacitate memorie RAM |
32GB |
|---|---|
| DRAM-Kit |
Yes |
| ECC |
No |
| Kit |
Yes |
| _Frecvența memorie RAM |
3200MHz |
| _Tip memorie RAM |
DDR4 |
| Cooling type |
Heatsink |
| Component for |
Laptop |
| Operating temperature (T-T) |
0 – 85 °C |
| Products per master (outer) case |
25 pc(s) |
| JEDEC standard |
Yes |
| Country of origin |
China, Taiwan |
| Internal memory |
64 GB |
| Harmonized System (HS) code |
84733020 |
| Height |
30 mm |
| __Latenta |
20 CL |
| Buffered memory type |
Unregistered (unbuffered) |
| Internal memory type |
DDR4 |
| Memory data transfer rate |
3200 MT/s |
| Row cycle time |
45.75 ns |
| Refresh row cycle time |
350 ns |
| Intel Extreme Memory Profile (XMP) |
2.0 |
| Programming power voltage (VPP) |
2.5 V |
| Package depth |
14 mm |
| Backlight |
No |
| Storage temperature (T-T) |
-55 – 100 °C |
| Package height |
171.5 mm |
| Memory voltage |
1.2 V |
| Memory layout (modules x size) |
2 x 32 GB |
| Package width |
95.3 mm |
| Master (outer) case width |
203.2 mm |
| Master (outer) case length |
311.2 mm |
| Master (outer) case height |
101.6 mm |
| Memory clock speed |
1600 MHz |
| Memory ranking |
2 |
| Depth |
69.6 mm |
| Memory form factor |
260-pin SO-DIMM |
| Module configuration |
4096M x 64 |
| CAS latency |
20 |
| Width |
3.8 mm |
| Kit quad channel |
Nu |
| Tip |
DDR4 SODIMM |
| Latenta |
17 – 20 CL |
| Tensiune alimentare |
1.2 V |
| Frecventa |
3200 MHz |
| Row active time |
26.25 ns |
| Capacitate |
64 GB |
| Kit dual channel |
Da |
| Weight |
15.2 g |
| Package weight |
40.3 g |
| Master (outer) case gross weight |
1.22 kg |
| Producator |
KINGSTON |
| Garantie |
999 |
Display
| _Capacitate memorie RAM |
32GB |
|---|---|
| DRAM-Kit |
Yes |
| ECC |
No |
| Kit |
Yes |
| _Frecvența memorie RAM |
3200MHz |
| _Tip memorie RAM |
DDR4 |
| Cooling type |
Heatsink |
| Component for |
Laptop |
| Operating temperature (T-T) |
0 – 85 °C |
| Products per master (outer) case |
25 pc(s) |
| JEDEC standard |
Yes |
| Country of origin |
China, Taiwan |
| Internal memory |
64 GB |
| Harmonized System (HS) code |
84733020 |
| Height |
30 mm |
| __Latenta |
20 CL |
| Buffered memory type |
Unregistered (unbuffered) |
| Internal memory type |
DDR4 |
| Memory data transfer rate |
3200 MT/s |
| Row cycle time |
45.75 ns |
| Refresh row cycle time |
350 ns |
| Intel Extreme Memory Profile (XMP) |
2.0 |
| Programming power voltage (VPP) |
2.5 V |
| Package depth |
14 mm |
| Backlight |
No |
| Storage temperature (T-T) |
-55 – 100 °C |
| Package height |
171.5 mm |
| Memory voltage |
1.2 V |
| Memory layout (modules x size) |
2 x 32 GB |
| Package width |
95.3 mm |
| Master (outer) case width |
203.2 mm |
| Master (outer) case length |
311.2 mm |
| Master (outer) case height |
101.6 mm |
| Memory clock speed |
1600 MHz |
| Memory ranking |
2 |
| Depth |
69.6 mm |
| Memory form factor |
260-pin SO-DIMM |
| Module configuration |
4096M x 64 |
| CAS latency |
20 |
| Width |
3.8 mm |
| Kit quad channel |
Nu |
| Tip |
DDR4 SODIMM |
| Latenta |
17 – 20 CL |
| Tensiune alimentare |
1.2 V |
| Frecventa |
3200 MHz |
| Row active time |
26.25 ns |
| Capacitate |
64 GB |
| Kit dual channel |
Da |
| Weight |
15.2 g |
| Package weight |
40.3 g |
| Master (outer) case gross weight |
1.22 kg |
| Producator |
KINGSTON |
| Garantie |
999 |
RAM
| _Capacitate memorie RAM |
32GB |
|---|---|
| DRAM-Kit |
Yes |
| ECC |
No |
| Kit |
Yes |
| _Frecvența memorie RAM |
3200MHz |
| _Tip memorie RAM |
DDR4 |
| Cooling type |
Heatsink |
| Component for |
Laptop |
| Operating temperature (T-T) |
0 – 85 °C |
| Products per master (outer) case |
25 pc(s) |
| JEDEC standard |
Yes |
| Country of origin |
China, Taiwan |
| Internal memory |
64 GB |
| Harmonized System (HS) code |
84733020 |
| Height |
30 mm |
| __Latenta |
20 CL |
| Buffered memory type |
Unregistered (unbuffered) |
| Internal memory type |
DDR4 |
| Memory data transfer rate |
3200 MT/s |
| Row cycle time |
45.75 ns |
| Refresh row cycle time |
350 ns |
| Intel Extreme Memory Profile (XMP) |
2.0 |
| Programming power voltage (VPP) |
2.5 V |
| Package depth |
14 mm |
| Backlight |
No |
| Storage temperature (T-T) |
-55 – 100 °C |
| Package height |
171.5 mm |
| Memory voltage |
1.2 V |
| Memory layout (modules x size) |
2 x 32 GB |
| Package width |
95.3 mm |
| Master (outer) case width |
203.2 mm |
| Master (outer) case length |
311.2 mm |
| Master (outer) case height |
101.6 mm |
| Memory clock speed |
1600 MHz |
| Memory ranking |
2 |
| Depth |
69.6 mm |
| Memory form factor |
260-pin SO-DIMM |
| Module configuration |
4096M x 64 |
| CAS latency |
20 |
| Width |
3.8 mm |
| Kit quad channel |
Nu |
| Tip |
DDR4 SODIMM |
| Latenta |
17 – 20 CL |
| Tensiune alimentare |
1.2 V |
| Frecventa |
3200 MHz |
| Row active time |
26.25 ns |
| Capacitate |
64 GB |
| Kit dual channel |
Da |
| Weight |
15.2 g |
| Package weight |
40.3 g |
| Master (outer) case gross weight |
1.22 kg |
| Producator |
KINGSTON |
| Garantie |
999 |
Storage
| _Capacitate memorie RAM |
32GB |
|---|---|
| DRAM-Kit |
Yes |
| ECC |
No |
| Kit |
Yes |
| _Frecvența memorie RAM |
3200MHz |
| _Tip memorie RAM |
DDR4 |
| Cooling type |
Heatsink |
| Component for |
Laptop |
| Operating temperature (T-T) |
0 – 85 °C |
| Products per master (outer) case |
25 pc(s) |
| JEDEC standard |
Yes |
| Country of origin |
China, Taiwan |
| Internal memory |
64 GB |
| Harmonized System (HS) code |
84733020 |
| Height |
30 mm |
| __Latenta |
20 CL |
| Buffered memory type |
Unregistered (unbuffered) |
| Internal memory type |
DDR4 |
| Memory data transfer rate |
3200 MT/s |
| Row cycle time |
45.75 ns |
| Refresh row cycle time |
350 ns |
| Intel Extreme Memory Profile (XMP) |
2.0 |
| Programming power voltage (VPP) |
2.5 V |
| Package depth |
14 mm |
| Backlight |
No |
| Storage temperature (T-T) |
-55 – 100 °C |
| Package height |
171.5 mm |
| Memory voltage |
1.2 V |
| Memory layout (modules x size) |
2 x 32 GB |
| Package width |
95.3 mm |
| Master (outer) case width |
203.2 mm |
| Master (outer) case length |
311.2 mm |
| Master (outer) case height |
101.6 mm |
| Memory clock speed |
1600 MHz |
| Memory ranking |
2 |
| Depth |
69.6 mm |
| Memory form factor |
260-pin SO-DIMM |
| Module configuration |
4096M x 64 |
| CAS latency |
20 |
| Width |
3.8 mm |
| Kit quad channel |
Nu |
| Tip |
DDR4 SODIMM |
| Latenta |
17 – 20 CL |
| Tensiune alimentare |
1.2 V |
| Frecventa |
3200 MHz |
| Row active time |
26.25 ns |
| Capacitate |
64 GB |
| Kit dual channel |
Da |
| Weight |
15.2 g |
| Package weight |
40.3 g |
| Master (outer) case gross weight |
1.22 kg |
| Producator |
KINGSTON |
| Garantie |
999 |
Video Card
| _Capacitate memorie RAM |
32GB |
|---|---|
| DRAM-Kit |
Yes |
| ECC |
No |
| Kit |
Yes |
| _Frecvența memorie RAM |
3200MHz |
| _Tip memorie RAM |
DDR4 |
| Cooling type |
Heatsink |
| Component for |
Laptop |
| Operating temperature (T-T) |
0 – 85 °C |
| Products per master (outer) case |
25 pc(s) |
| JEDEC standard |
Yes |
| Country of origin |
China, Taiwan |
| Internal memory |
64 GB |
| Harmonized System (HS) code |
84733020 |
| Height |
30 mm |
| __Latenta |
20 CL |
| Buffered memory type |
Unregistered (unbuffered) |
| Internal memory type |
DDR4 |
| Memory data transfer rate |
3200 MT/s |
| Row cycle time |
45.75 ns |
| Refresh row cycle time |
350 ns |
| Intel Extreme Memory Profile (XMP) |
2.0 |
| Programming power voltage (VPP) |
2.5 V |
| Package depth |
14 mm |
| Backlight |
No |
| Storage temperature (T-T) |
-55 – 100 °C |
| Package height |
171.5 mm |
| Memory voltage |
1.2 V |
| Memory layout (modules x size) |
2 x 32 GB |
| Package width |
95.3 mm |
| Master (outer) case width |
203.2 mm |
| Master (outer) case length |
311.2 mm |
| Master (outer) case height |
101.6 mm |
| Memory clock speed |
1600 MHz |
| Memory ranking |
2 |
| Depth |
69.6 mm |
| Memory form factor |
260-pin SO-DIMM |
| Module configuration |
4096M x 64 |
| CAS latency |
20 |
| Width |
3.8 mm |
| Kit quad channel |
Nu |
| Tip |
DDR4 SODIMM |
| Latenta |
17 – 20 CL |
| Tensiune alimentare |
1.2 V |
| Frecventa |
3200 MHz |
| Row active time |
26.25 ns |
| Capacitate |
64 GB |
| Kit dual channel |
Da |
| Weight |
15.2 g |
| Package weight |
40.3 g |
| Master (outer) case gross weight |
1.22 kg |
| Producator |
KINGSTON |
| Garantie |
999 |
Connectivity
| _Capacitate memorie RAM |
32GB |
|---|---|
| DRAM-Kit |
Yes |
| ECC |
No |
| Kit |
Yes |
| _Frecvența memorie RAM |
3200MHz |
| _Tip memorie RAM |
DDR4 |
| Cooling type |
Heatsink |
| Component for |
Laptop |
| Operating temperature (T-T) |
0 – 85 °C |
| Products per master (outer) case |
25 pc(s) |
| JEDEC standard |
Yes |
| Country of origin |
China, Taiwan |
| Internal memory |
64 GB |
| Harmonized System (HS) code |
84733020 |
| Height |
30 mm |
| __Latenta |
20 CL |
| Buffered memory type |
Unregistered (unbuffered) |
| Internal memory type |
DDR4 |
| Memory data transfer rate |
3200 MT/s |
| Row cycle time |
45.75 ns |
| Refresh row cycle time |
350 ns |
| Intel Extreme Memory Profile (XMP) |
2.0 |
| Programming power voltage (VPP) |
2.5 V |
| Package depth |
14 mm |
| Backlight |
No |
| Storage temperature (T-T) |
-55 – 100 °C |
| Package height |
171.5 mm |
| Memory voltage |
1.2 V |
| Memory layout (modules x size) |
2 x 32 GB |
| Package width |
95.3 mm |
| Master (outer) case width |
203.2 mm |
| Master (outer) case length |
311.2 mm |
| Master (outer) case height |
101.6 mm |
| Memory clock speed |
1600 MHz |
| Memory ranking |
2 |
| Depth |
69.6 mm |
| Memory form factor |
260-pin SO-DIMM |
| Module configuration |
4096M x 64 |
| CAS latency |
20 |
| Width |
3.8 mm |
| Kit quad channel |
Nu |
| Tip |
DDR4 SODIMM |
| Latenta |
17 – 20 CL |
| Tensiune alimentare |
1.2 V |
| Frecventa |
3200 MHz |
| Row active time |
26.25 ns |
| Capacitate |
64 GB |
| Kit dual channel |
Da |
| Weight |
15.2 g |
| Package weight |
40.3 g |
| Master (outer) case gross weight |
1.22 kg |
| Producator |
KINGSTON |
| Garantie |
999 |
Features
| _Capacitate memorie RAM |
32GB |
|---|---|
| DRAM-Kit |
Yes |
| ECC |
No |
| Kit |
Yes |
| _Frecvența memorie RAM |
3200MHz |
| _Tip memorie RAM |
DDR4 |
| Cooling type |
Heatsink |
| Component for |
Laptop |
| Operating temperature (T-T) |
0 – 85 °C |
| Products per master (outer) case |
25 pc(s) |
| JEDEC standard |
Yes |
| Country of origin |
China, Taiwan |
| Internal memory |
64 GB |
| Harmonized System (HS) code |
84733020 |
| Height |
30 mm |
| __Latenta |
20 CL |
| Buffered memory type |
Unregistered (unbuffered) |
| Internal memory type |
DDR4 |
| Memory data transfer rate |
3200 MT/s |
| Row cycle time |
45.75 ns |
| Refresh row cycle time |
350 ns |
| Intel Extreme Memory Profile (XMP) |
2.0 |
| Programming power voltage (VPP) |
2.5 V |
| Package depth |
14 mm |
| Backlight |
No |
| Storage temperature (T-T) |
-55 – 100 °C |
| Package height |
171.5 mm |
| Memory voltage |
1.2 V |
| Memory layout (modules x size) |
2 x 32 GB |
| Package width |
95.3 mm |
| Master (outer) case width |
203.2 mm |
| Master (outer) case length |
311.2 mm |
| Master (outer) case height |
101.6 mm |
| Memory clock speed |
1600 MHz |
| Memory ranking |
2 |
| Depth |
69.6 mm |
| Memory form factor |
260-pin SO-DIMM |
| Module configuration |
4096M x 64 |
| CAS latency |
20 |
| Width |
3.8 mm |
| Kit quad channel |
Nu |
| Tip |
DDR4 SODIMM |
| Latenta |
17 – 20 CL |
| Tensiune alimentare |
1.2 V |
| Frecventa |
3200 MHz |
| Row active time |
26.25 ns |
| Capacitate |
64 GB |
| Kit dual channel |
Da |
| Weight |
15.2 g |
| Package weight |
40.3 g |
| Master (outer) case gross weight |
1.22 kg |
| Producator |
KINGSTON |
| Garantie |
999 |
Battery
| _Capacitate memorie RAM |
32GB |
|---|---|
| DRAM-Kit |
Yes |
| ECC |
No |
| Kit |
Yes |
| _Frecvența memorie RAM |
3200MHz |
| _Tip memorie RAM |
DDR4 |
| Cooling type |
Heatsink |
| Component for |
Laptop |
| Operating temperature (T-T) |
0 – 85 °C |
| Products per master (outer) case |
25 pc(s) |
| JEDEC standard |
Yes |
| Country of origin |
China, Taiwan |
| Internal memory |
64 GB |
| Harmonized System (HS) code |
84733020 |
| Height |
30 mm |
| __Latenta |
20 CL |
| Buffered memory type |
Unregistered (unbuffered) |
| Internal memory type |
DDR4 |
| Memory data transfer rate |
3200 MT/s |
| Row cycle time |
45.75 ns |
| Refresh row cycle time |
350 ns |
| Intel Extreme Memory Profile (XMP) |
2.0 |
| Programming power voltage (VPP) |
2.5 V |
| Package depth |
14 mm |
| Backlight |
No |
| Storage temperature (T-T) |
-55 – 100 °C |
| Package height |
171.5 mm |
| Memory voltage |
1.2 V |
| Memory layout (modules x size) |
2 x 32 GB |
| Package width |
95.3 mm |
| Master (outer) case width |
203.2 mm |
| Master (outer) case length |
311.2 mm |
| Master (outer) case height |
101.6 mm |
| Memory clock speed |
1600 MHz |
| Memory ranking |
2 |
| Depth |
69.6 mm |
| Memory form factor |
260-pin SO-DIMM |
| Module configuration |
4096M x 64 |
| CAS latency |
20 |
| Width |
3.8 mm |
| Kit quad channel |
Nu |
| Tip |
DDR4 SODIMM |
| Latenta |
17 – 20 CL |
| Tensiune alimentare |
1.2 V |
| Frecventa |
3200 MHz |
| Row active time |
26.25 ns |
| Capacitate |
64 GB |
| Kit dual channel |
Da |
| Weight |
15.2 g |
| Package weight |
40.3 g |
| Master (outer) case gross weight |
1.22 kg |
| Producator |
KINGSTON |
| Garantie |
999 |
General
| _Capacitate memorie RAM |
32GB |
|---|---|
| DRAM-Kit |
Yes |
| ECC |
No |
| Kit |
Yes |
| _Frecvența memorie RAM |
3200MHz |
| _Tip memorie RAM |
DDR4 |
| Cooling type |
Heatsink |
| Component for |
Laptop |
| Operating temperature (T-T) |
0 – 85 °C |
| Products per master (outer) case |
25 pc(s) |
| JEDEC standard |
Yes |
| Country of origin |
China, Taiwan |
| Internal memory |
64 GB |
| Harmonized System (HS) code |
84733020 |
| Height |
30 mm |
| __Latenta |
20 CL |
| Buffered memory type |
Unregistered (unbuffered) |
| Internal memory type |
DDR4 |
| Memory data transfer rate |
3200 MT/s |
| Row cycle time |
45.75 ns |
| Refresh row cycle time |
350 ns |
| Intel Extreme Memory Profile (XMP) |
2.0 |
| Programming power voltage (VPP) |
2.5 V |
| Package depth |
14 mm |
| Backlight |
No |
| Storage temperature (T-T) |
-55 – 100 °C |
| Package height |
171.5 mm |
| Memory voltage |
1.2 V |
| Memory layout (modules x size) |
2 x 32 GB |
| Package width |
95.3 mm |
| Master (outer) case width |
203.2 mm |
| Master (outer) case length |
311.2 mm |
| Master (outer) case height |
101.6 mm |
| Memory clock speed |
1600 MHz |
| Memory ranking |
2 |
| Depth |
69.6 mm |
| Memory form factor |
260-pin SO-DIMM |
| Module configuration |
4096M x 64 |
| CAS latency |
20 |
| Width |
3.8 mm |
| Kit quad channel |
Nu |
| Tip |
DDR4 SODIMM |
| Latenta |
17 – 20 CL |
| Tensiune alimentare |
1.2 V |
| Frecventa |
3200 MHz |
| Row active time |
26.25 ns |
| Capacitate |
64 GB |
| Kit dual channel |
Da |
| Weight |
15.2 g |
| Package weight |
40.3 g |
| Master (outer) case gross weight |
1.22 kg |
| Producator |
KINGSTON |
| Garantie |
999 |
